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Mechanical Properties of Meta-aramid Paper Composites in High Temperature Environment
Received:December 25, 2023  
DOI：10.11980/j.issn.0254-508X.2024.06.012
Key Words:meta-aramid paper  meta-aramid honeycomb wall material  high temperature  mechanical properties
Fund Project:国家重点研发计划（2022YFF0610700）；国家重点研发计划（2021YFB3700104）。
Author NameAffiliationPostcode
WANG Mingjie School of Light Industry and Chemical Engineering， South China University of Technology， Guangzhou， Guangdong Province，510640 510640
CHEN Hongcheng School of Light Industry and Chemical Engineering， South China University of Technology， Guangzhou， Guangdong Province，510640 510640
WANG Yi School of Light Industry and Chemical Engineering， South China University of Technology， Guangzhou， Guangdong Province，510640 510640
GUAN Kang School of Materials Science and Engineering， South China University of Technology， Guangzhou， Guangdong Province， 510640 510640
LONG Jin School of Light Industry and Chemical Engineering， South China University of Technology， Guangzhou， Guangdong Province，510640 510640
HU Jian School of Light Industry and Chemical Engineering， South China University of Technology， Guangzhou， Guangdong Province，510640 510640
LU Zhiyuan AVIC Composite Co., Ltd.，Beijing，101300 101300
LUO Yuqing AVIC Composite Co., Ltd.，Beijing，101300 101300
YANG Jinjun AVIC Composite Co., Ltd.，Beijing，101300 101300
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Abstract:In this study， the effect of impregnated phenolic resin on the mechanical properties of aramid paper was analyzed， and the mechanical properties of meta-aramid paper and meta-aramid checkerboard materials were investigated at seven different temperature points， including 25~280 ℃， and the high-temperature mechanical properties of meta-aramid honeycomb were predicted from the mechanical property parameters of checkerboard materials. The results showed that the introduction of phenolic resin increased the tensile modulus and strength of the meta-aramid lattice wall materials by 1.2 and 1.4 times compared with that of the meta-aramid paper at room temperature. Both the meta-aramid paper and its lattice wall material showed excellent high-temperature resistance. At 225 ℃， the tensile strength and modulus retention rates were 62.7% and 77.1% for meta-aramid paper and 62.0% and 69.0% for aramid lattice wall material， respectively， compared with those at room temperature. And the strength retention rate of the meta-aramid paper and its lattice wall material at 280 ℃ was still 44.1%. The tensile fracture of meta-aramid paper and meta-aramid lattice wall materials at high temperatures showed less fiber pullout and more fiber breakage damage modes. The key performance parameters of paper were proposed to predict the mechanical properties of honeycomb at high temperature， and the predicted values were in good agreement with the measured values. At room temperature， the measured value of anisotropic stable compression modulus of meta-aramid honeycomb deviated from the theoretical value by 7.7%， and the simulated value deviated from the measured value of honeycomb by 1.8%. At 175 ℃， the deviation of the measured W shear modulus from the theoretical value was 12.5%， and the deviation of the simulated W shear modulus from the measured value of honeycomb was 3.9%.
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