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Preparation of the Resin Used for Reinforcing Polyimide FiberPaper-based Composites
Received:January 08, 2020  
DOI:10.11980/j.issn.0254-508X.2020.06.001
Key Words:polyimide fibre  epoxy resin  silicone resin  polyimide resin  paper-based material
Fund Project:国家重点研发计划项目(2017YFB0308301)。
Author NameAffiliationPostcode
WANG Jun School of Light Industry and Chemical Engineering, Dalian Polytechnic University, Dalian, Liaoning Province, 116034 116034
PING Qingwei School of Light Industry and Chemical Engineering, Dalian Polytechnic University, Dalian, Liaoning Province, 116034 116034
ZHANG Jian School of Light Industry and Chemical Engineering, Dalian Polytechnic University, Dalian, Liaoning Province, 116034 116034
SHENG Xueru School of Light Industry and Chemical Engineering, Dalian Polytechnic University, Dalian, Liaoning Province, 116034 116034
LI Na School of Light Industry and Chemical Engineering, Dalian Polytechnic University, Dalian, Liaoning Province, 116034 116034
SHI Haiqiang School of Light Industry and Chemical Engineering, Dalian Polytechnic University, Dalian, Liaoning Province, 116034 116034
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Abstract:In order to improve the strength, high temperature resistance, toughness and barrier properties of polyimide fiber paper-based materials, the impregnating resin with high adhesion, easy curing, good flexibility and high temperature resistance was prepared. First, the epoxy resin modified by vinyl silicone resin was prepared to improve the toughness and curing property of the impregnated resin. Then polyimide resin was added to prepare the superalloy resin. The results showed that when 30% of vinyl silicone was used, the modified resin had better toughness and crosslinking degree, then 5% polyimide resin was added, 5% resin mass loss temperature was 339.2℃, and there was no significant glass transition at high temperature. The prepared resins were respectively used to impregnate paper-based material made of polyimide fiber, the results showed that the paper impregnated by vinyl silicone modified epoxy resin had good bonding strength, and the contact angle reached 148.71° due to the smooth surface, the enhancement effect of alloy resin was obvious at high temperature, the tensile index of paper reached 35.1 N·m/g at 200℃.
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