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Study on Preparation and Performance of Boron Nitride/Aramid Composite Thermal Conductive Insulating Paper
Received:January 12, 2026  Revised:March 19, 2026
DOI:10.11980/j.issn.0254-508X.2026.07.009
Key Words:composite aramid paper  hexagonal boron nitride  thermal conductivity  insulation performance
Fund Project:国家重点研发计划(2024YFB3713200)。
Author NameAffiliationPostcode
Yin Zhiwei* 1State Key Lab of Bio-based Fiber Materials, Tianjin Key Lab of Pulp and Paper, China Light Industry Key Lab of Papermaking and Biorefinery, China Textile Industry Key Lab of High-performance Fibers Wet-laid Nonwoven Materials, Tianjin University of Science and Technology, Tianjin, 300450 300450
Zhang Junhua 1State Key Lab of Bio-based Fiber Materials, Tianjin Key Lab of Pulp and Paper, China Light Industry Key Lab of Papermaking and Biorefinery, China Textile Industry Key Lab of High-performance Fibers Wet-laid Nonwoven Materials, Tianjin University of Science and Technology, Tianjin, 300450
2Yantai Metastar Special Paper Co., Ltd., Yantai, Shandong Province, 264006 
264006
Liu Ruixiang 1State Key Lab of Bio-based Fiber Materials, Tianjin Key Lab of Pulp and Paper, China Light Industry Key Lab of Papermaking and Biorefinery, China Textile Industry Key Lab of High-performance Fibers Wet-laid Nonwoven Materials, Tianjin University of Science and Technology, Tianjin, 300450
2Yantai Metastar Special Paper Co., Ltd., Yantai, Shandong Province, 264006 
264006
Wang Ying 1State Key Lab of Bio-based Fiber Materials, Tianjin Key Lab of Pulp and Paper, China Light Industry Key Lab of Papermaking and Biorefinery, China Textile Industry Key Lab of High-performance Fibers Wet-laid Nonwoven Materials, Tianjin University of Science and Technology, Tianjin, 300450 300450
Ji Wantong 1State Key Lab of Bio-based Fiber Materials, Tianjin Key Lab of Pulp and Paper, China Light Industry Key Lab of Papermaking and Biorefinery, China Textile Industry Key Lab of High-performance Fibers Wet-laid Nonwoven Materials, Tianjin University of Science and Technology, Tianjin, 300450 300450
Sun Jing 2Yantai Metastar Special Paper Co., Ltd., Yantai, Shandong Province, 264006 264006
Wang Xu 3College of Polymer Science and Engineering, Sichuan University, Chengdu, Sichuan Province, 610065 610065
Cheng Bowen 1State Key Lab of Bio-based Fiber Materials, Tianjin Key Lab of Pulp and Paper, China Light Industry Key Lab of Papermaking and Biorefinery, China Textile Industry Key Lab of High-performance Fibers Wet-laid Nonwoven Materials, Tianjin University of Science and Technology, Tianjin, 300450 300450
Yang Shuo* 1State Key Lab of Bio-based Fiber Materials, Tianjin Key Lab of Pulp and Paper, China Light Industry Key Lab of Papermaking and Biorefinery, China Textile Industry Key Lab of High-performance Fibers Wet-laid Nonwoven Materials, Tianjin University of Science and Technology, Tianjin, 300450 300450
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Abstract:In this study, micron-sized hexagonal boron nitride (h-BN) with varying plate diameters were used as thermal conductive fillers and incorporated into aramid paper matrix. By combining wet-forming technology with hot-pressing process, the composite aramid paper was successfully prepared. The thermal conductivity, insulation performance, and mechanical properties of the composite aramid paper were systematically tested to investigate the synergistic effects of h-BN with different plate diameters and the mechanisms underlying the enhancement of the composite aramid paper’s performance. The results showed that combining large-diameter-sized h-BN and small-diameter-sized h-BN in a mass ratio of 1∶1 resulted in mix-diameter-sized h-BN (M-BN) ; when the M-BN addition amount was 30%, the prepared composite aramid paper M-BN-30 exhibited in-plane and through-plane thermal conductivities of 9.754 and 0.171 0 W/(m·K) at 25 ℃, respectively, representing increases of 11.1% and 59.7% compared to the original aramid paper. Furthermore, the breakdown strength of M-BN-30 increased to 14.82 kV/mm, with a 33.3% improvement over the original aramid paper. Additionally, M-BN-30 exhibited low dielectric constant and dielectric loss factor values of 3.25 and 0.025 9, respectively.
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