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| Modified Lamination Method for In-plane Thermal Conductivity Testing of Paper-based Materials |
| Received:February 23, 2025 Revised:April 11, 2025 |
| DOI：10.11980/j.issn.0254-508X.2025.07.014 |
| Key Words:transient plane source method steady-state thermal resistance testing aramid paper thermal conductivity |
| Fund Project:国家重点研发计划（2021YFB3700104）。 |
| Author Name | Affiliation | Postcode | | SHEN Jiachen* | School of Light Industry and Engineering, South China University of Technology, Guangzhou, Guangdong Province, 510640 | 510640 | | QIU Chuntao | School of Light Industry and Engineering, South China University of Technology, Guangzhou, Guangdong Province, 510640 | 510640 | | WANG Yi | School of Light Industry and Engineering, South China University of Technology, Guangzhou, Guangdong Province, 510640 | 510640 | | LONG Jin | School of Light Industry and Engineering, South China University of Technology, Guangzhou, Guangdong Province, 510640 | 510640 | | XIONG Zhiyuan* | School of Light Industry and Engineering, South China University of Technology, Guangzhou, Guangdong Province, 510640 | 510640 | | HU Jian | School of Light Industry and Engineering, South China University of Technology, Guangzhou, Guangdong Province, 510640 | 510640 |
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| Abstract:This paper proposed a new method for accurately measuring the in-plane thermal conductivity of paper， which combined the transient plane source method and the steady-state thermal resistance method. Firstly， the thermal conductivity of laminated paper was measured using the transient method. Then， the interlayer thermal resistance between paper layers was determined using the steady-state method， and the in-plane thermal conductivity of single-layer paper was calculated. Taking aramid paper as a typical research object， specific testing conditions were proposed through experimental optimization： The stack thickness of the paper should be controlled at 3 mm or more (about 50 layers)， which could effectively prevent transient heat dissipation during the testing process. The applied pressure should not exceed 0.12 MPa to reduce changes to the paper structure and ensure the stability and reliability of the test results. Under these conditions， the measured internal thermal conductivity of the aramid paper surface was 0.41 W/(m·K). In addition， the modified method also showed good applicability in testing aramid composite paper containing nano boron nitride fillers， demonstrating good application prospects and promotion value. |
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