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Effect of the Amount of Para-aramid Nanofiber on the Structure and Properties of Para-aramid Paper
Received:August 07, 2022  
DOI:10.11980/j.issn.0254-508X.2022.11.002
Key Words:aramid paper  nanofiber  fibrid  structure  property
Fund Project:国家自然科学基金(52073154);山东省重点研发计划(重大科技创新工程)项目(2019TSLH0109);清华大学(化工系)-黄河三角洲京博化工研究院有限公司高性能高分子材料联合研究中心基金。
Author NameAffiliationPostcode
DONG Zhirong Shandong Jufang New Materials Co. Ltd. Binzhou Shandong Province 256500 256500
CHEN Yuexi Key Lab of Advanced Materials (MOE) Department of Chemical Engineering Tsinghua University Beijing 100084 100084
LIU Yutian Shandong Jufang New Materials Co. Ltd. Binzhou Shandong Province 256500 256500
TIAN Wei Shandong Jufang New Materials Co. Ltd. Binzhou Shandong Province 256500 256500
ZHANG Yunkui Shandong Jufang New Materials Co. Ltd. Binzhou Shandong Province 256500 256500
YAO Kuncheng Shandong Jufang New Materials Co. Ltd. Binzhou Shandong Province 256500 256500
TUO Xinlin* Key Lab of Advanced Materials (MOE) Department of Chemical Engineering Tsinghua University Beijing 100084 100084
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Abstract:Para-aramid nanofibers prepared by in situ-polymerization method and commercial para-aramid fibrid were used as adhesive fibers, and mixed with para-aramid short-cut fibers to fabricate para-aramid paper by wet process, respectively. The effects of nanofiber and fibrid with their amount on the structure and properties of paper were studied in detail, and the reaction mechanism of which was also discussed. The results showed that the paper formation, mechanical strength and electrical insulation strength of para-aramid nanofiber paper were better than fibrid paper. With the content of nanofiber or fibrid at 40% in paper, the tensile and tear indexes of para-aramid nanofiber paper were 44% and 57% higher than those of fibrid paper, respectively. Moreover, the electrical breakdown strength of para-aramid nanofiber paper increased 80%. The difference was mainly due to the higher surface activity of para-aramid nanofibers, resulting a good machinability and secondary assembly performance.
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