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Study on Pore Structure Regulation of h-BN/TOCNF Aerogel and Thermal Conductivity of Its Composite Film
Received:September 09, 2021  
DOI：10.11980/j.issn.0254-508X.2021.11.005
Key Words:h-BN  TOCNF  aerogel  composite film  electrical insulation property  thermal conductivity
Fund Project:“十三五”国家重点研发计划课题（2017YFD0601005）。
Author NameAffiliationPostcode
WANG Xiu Jiangsu Provincial Key Lab of Pulp and Paper Science and Technology， Nanjing Forestry University， Nanjing， Jiangsu Province， 210037 210037
SUN Mengya Jiangsu Provincial Key Lab of Pulp and Paper Science and Technology， Nanjing Forestry University， Nanjing， Jiangsu Province， 210037 210037
WANG Xuebin Jiangsu Provincial Key Lab of Pulp and Paper Science and Technology， Nanjing Forestry University， Nanjing， Jiangsu Province， 210037 210037
WANG Shumei Jiangsu Provincial Key Lab of Pulp and Paper Science and Technology， Nanjing Forestry University， Nanjing， Jiangsu Province， 210037 210037
BIAN Huiyang Jiangsu Provincial Key Lab of Pulp and Paper Science and Technology， Nanjing Forestry University， Nanjing， Jiangsu Province， 210037 210037
WU Weibing Jiangsu Provincial Key Lab of Pulp and Paper Science and Technology， Nanjing Forestry University， Nanjing， Jiangsu Province， 210037 210037
DAI Hongqi* Jiangsu Provincial Key Lab of Pulp and Paper Science and Technology， Nanjing Forestry University， Nanjing， Jiangsu Province， 210037 210037
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Abstract:To solve the heat-dissipation issue of miniaturized electronic and electrical equipment， the hexagonal boron nitride （h-BN）/TEMPO-oxidization nanocellulose （TOCNF） aerogels with different pore structure were designed and prepared in this study， which was then compounded with TOCNF to fabricate h-BN/TOCNF composite films. The results showed that when the ratio of h-BN to TOCNF was 3 ∶ 1， h-BN could form a 3D thermal conductive pathway along the TOCNF framework inside the h-BN/TOCNF aerogelin which TOCNF generated the minimum thermal resistance between h-BNs and played a favorable role in dispersing h-BNs， showing the maximum structuring efficiency of the 3D thermal conductive pathway. The thermal conductivity of the h-BN/TOCNF composite film was as high as 1.355 W/（m·K）， 228% higher than that of the pure TOCNF film， the volume resistivity was 4.53×1014 Ω•cm， indicating good electrical insulation property. In addition， thermogravimetric （TG） analysis showed that the initial decomposition temperature of h-BN/TOCNF composite film was about 210°C， showing good thermal stability. Furthermore， desirable mechanical properties of h-BN/TOCNF composite film were endowed， the elongation at break and tensile strength of h-BN/TOCNF1 were 13% and 24.8 MPa when the ratio of h-BN to TOCNF was 1 ∶ 1， respectively. It was worth noting that with the increase of h-BN loading， the elongation at break of the composite films decreased， while the tensile strength had negligible variation.
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